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One Component Epoxy Adhesive SA-1 Useful for the Microelectronics Industry Surface Mount technology Adhesives are commonly used to bond SMD (surface mounting devices) or SMT (surface mounting technologies) to PCBs (printing circuit boards) for wave soldering purposes in the microelectronics industry.Surface mount technology has resulted in smaller more powerful circuitry, manufactured on highly automated production lines. These automated assembly processes require new developments in components, materials, and the machinery to handle them.Thus, the surface mount adhesive is one of the key materials in this new technology which is replacing the conventional assembly process. In addition, this fast curing adhesive can be used in a wide range of applications. Introduction There are two major types of adhesives: epoxies and acrylics. Epoxies are the oldest and most used adhesives, and thermoset, structurally strong adhesives which are available as liquids, pastes, films, and powders in one or two component systems.
Our Technology The SA-1 adhesive made by this invention is a one-component system. It consists of epoxy resin, acid anhydride, curing accelerator and dye filler etc. It cures at 120 oC in 2-3 minutes and 150 oC in 1-2 minutes.Previous one component epoxies required cure times of an hour or more at temperatures above 150 oC.Our SA-1adhesive meets the challenges of modern operations with advances in flow properties, fast curing, low ionic content and screen printing. This technology was featured in a simple fabricated process with very low investment costs. This invention is a mature technology, with volume production in China TOP THREE RELATED SITES Superfine Silica SolPlasma Reactive Ion Etchor Polypropylene Additive
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Contact CTC:
China-America Technology Corp. TEL: +1-212-650-5606
Marshak Science Bldg., Rm. J423 FAX: +1-212-650-5608
138th St. at Convent Ave.
New York, NY 10031
ctc@chinatech.com
